BEIJING, April 16 (Xinhua) -- China's leading semiconductor display manufacturer BOE Technology Group on Wednesday announced a strategic partnership with U.S. chip giant Qualcomm to collaborate on innovative display products featuring Qualcomm 3D Sonic ultrasonic fingerprint sensors.
The two companies expect to provide global users with more high value-added products and solutions based on the tight integration of their key technologies including sensors, antennae and display picture processing.
Integrating Qualcomm 3D Sonic sensors onto BOE's flexible OLED displays will bring a more streamlined solution that can enable smartphone OEMs to create unique products with high-security fingerprint identification.
"As a global leader in the semiconductor display industry, BOE has been providing global users with excellent intelligent interface devices and solutions," said Gao Wenbao, executive vice president of BOE, adding that the company will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensors in the second half of 2020.
Roawen Chen, senior vice president and chief operations officer of Qualcomm, said the collaboration with BOE is an example of Qualcomm's dedication to improve its collaboration in China. "We look forward to further strengthening our innovative collaborations with BOE in key areas like 5G, extended reality and IoT."
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