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Chinese researchers develop novel technique enabling high-performance circuits to fit irregular surfaces
Integrating high-performance circuits into irregular 3D surfaces -- such as helmets, curved panels or artificial joints -- has long been a tough challenge. However, Chinese researchers have recently overcome this hurdle with a new breakthrough: sophisticated electronic circuits that, when treated with warm air or water, can tightly adhere to irregular surfaces, much like shrink-wrap film.
January13,2026
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