BEIJING, Dec. 11 (Xinhua) -- China's Gcl System Integration Technology (002506.SZ) announced that it plans to issue a maximum of 1.01 billion A-shares to raise 5 billion yuan via a private placement plan.
Of the proceeds raised via the private placement, a total of 2.55 billion yuan will be used for a large size regenerative wafer semiconductor project, 690 million yuan for C-Si material deep processing project, 260 million yuan for a semiconductor wafer single crystal furnace and related equipment project, and the remaining 1.5 billion yuan to replenish its working capital, according to the company's filing.
After the regenerative wafer semiconductor project is completed, it will have an annual output of 600,000 8-inch regenerative wafers and 3 million 12-inch regenerative wafers, said the company. (Edited by Ma Xin, maxin11@xinhua.org)
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